Bioconversion of food waste to biocompatible wet-laid fungal filmsShow others and affiliations
2022 (English)In: Materials & design, ISSN 0264-1275, E-ISSN 1873-4197, Vol. 216, article id 110534Article in journal (Refereed) Published
Sustainable development
According to the author(s), the content of this publication falls within the area of sustainable development.
Abstract [en]
The fungus Rhizopus delemar was grown on bread waste in a submerged cultivation process and wet-laid into films. Alkali or enzyme treatments were used to isolate the fungal cell wall. A heat treatment was also applied to deactivate biological activity of the fungus. Homogenization of fungal biomass was done by an iterative ultrafine grinding process. Finally, the biomass was cast into films by a wet-laid process. Ultrafine grinding resulted in densification of the films. Fungal films showed tensile strengths of up to 18.1 MPa, a Young's modulus of 2.3 GPa and a strain at break of 1.4%. Highest tensile strength was achieved using alkali treatment, with SEM analysis showing a dense and highly organized structure. In contrast, less organized structures were obtained using enzymatic or heat treatments. A cell viability assay and fluorescent staining confirmed the biocompatibility of the films. A promising route for food waste valorization to sustainable fungal wet-laid films was established. © 2022 The Authors
Place, publisher, year, edition, pages
Elsevier, 2022. Vol. 216, article id 110534
Keywords [en]
Biocompatible, Filamentous fungi, Food waste, Ultrafine grinding, Wet-laid film, Zygomycetes, Bioactivity, Elastic moduli, Fungi, Grinding (machining), Heat treatment, Tensile strength, Alkali treatment, Cultivation process, Filamentous fungus, Organized structure, Rhizopus delemar, Submerged cultivation, Ultra-fine grinding, Biocompatibility
National Category
Other Industrial Biotechnology Bio Materials Polymer Chemistry
Research subject
Resource Recovery
Identifiers
URN: urn:nbn:se:hb:diva-27825DOI: 10.1016/j.matdes.2022.110534ISI: 000806351300008Scopus ID: 2-s2.0-85126375844OAI: oai:DiVA.org:hb-27825DiVA, id: diva2:1656115
Funder
Vinnova, 2018-040932022-05-042022-05-042023-02-20